| 发表时间 |
论著（论文）名称 |
论著（论文）作者 |
发表载体 |
| 2017 |
Interfacial Properties of Cu/Ni/Mg2Si Joints Prepared in One Step by the Spark Plasma Sintering Method |
Renyao Yang, Shaoping Chen*, Wenhao Fan, Xiufeng Gao, Yang Long, Wenxian Wang, and Zuhair A. Munir |
Journal of Alloys and Compounds |
| 2017 |
Mg2Si热电材料与Cu/Ni复合电极的接头界面及性能 |
龙洋，陈少平*，张华，胡利方，樊文浩，孟庆森，王文先 |
稀有金属（接收） |
| 2017 |
Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure |
Xiufeng Gao , Shaoping Chen,*, Feng Dong , Lifang Hu , Renyao Yang , Wenxian Wang , and Zuhair A. Munir |
J Mater Sci 52:3535–3544 |
| 2016 |
Improvement in thermoelectric performance of In6Se7 by substitution of Sn for In |
Min Cheng, Shaoping Chen*, Zhengliang Du, Xianglian Liu, Jiaolin Cui* |
Physica Status Solidi A: Applications and Materials Science
213(8):2176-2182 |
| 2016 |
微波辅助固相反应结合MgH2制备Mg2Si1-xSnx基热电材料及性能研究 |
王彦坤，陈少平*，樊文浩，张华，孟庆森，杨江峰，催缴林 |
稀有金属材料与工程45(3):755-759,2016 |
| 2016 |
硅纳米线复合Mg2Si基热电材料的制备与性能研究 |
杜子良，陈少平*，王彦坤 ，樊文浩，孟庆森，杨江锋，崔教林
|
稀有金属材料与工程
45(10):2717-2722 |
| 2015 |
Improvement of the thermoelectric performance of InSe-based alloys doped with Sn
|
Xiaojing Hou, Shaoping Chen*, Zhengliang Du, Xianglian Liu, Jiaolin Cui* |
RSC Advances
2015, 5:102856 - 102862
|
| 2015 |
微波低温制备Mg2Si0.4Sn0.6-yBiy热电材料的传输机制初探 |
张华，陈少平*，龙洋，樊文浩* |
物理学报
64(24):247302.2015 |
| 2015 |
自分散SiNWs粉体的制备及形貌表征.功能材料 |
张霞, 陈少平*, 樊文浩 等 |
功能材料
46(19):19126-19130,2015 |
| 2015 |
电场激活Ti/Ni扩散偶连接界面相变规律与力学性能的研究 |
董凤; 陈少平*; 樊文浩; 胡利方; 孟庆森 |
稀有金属材料与工程 44(2):349-354,2015 |
| 2015 |
电场作用下AZ31B/Cu扩散界面的结构及性能 |
董凤; 陈少平*; 胡利方; 樊文浩; 孟庆森 |
材料工程,
2015,43(2):35-40 |
| 2015 |
管式反应法制备Mg2Sn基热电材料及其性能研究 |
焦媛媛，樊文浩，陈少平*,鲍亮亮，孟庆森 |
稀有金属材料与工程44(2):438-442, 2015 |
| 2015 |
One-step Low Temperature Reactive Consolidation of High Purity Nanocrystalline Mg2Si |
Shaoping Chen*, Xia Zhang, Wenhao Fan, Qingsen Meng |
Journal of Alloys and Compounds
625:251-257, 2015 |
| 2014 |
Thermoelectric transport properties and structure of Mg2Si0.8Sn0.2 prepared by ECAS under different current intensities |
Fan, Wen-Hao; Jiao, Yuan-Yuan; Chen, Rui-Xue; Wu, Di-Yang; Meng, Qing-Sen; Chen, Shao-Ping* |
Rare Metals, 33(2): 215-218,2014 |
| 2014 |
Thermoelectric properties of Cu2Ga4Te7 based compounds with Zn substitution for Cu and Ga |
Shaoping Chen, Wei Ren, Qingsen Meng, Jiaolin Cui |
Physica Status Solidi A- 618-624，2014 |
| 2014 |
Lattice defects and thermoelectric properties: the case of p-type CuInTe2 chalcopyrite on introduction of zinc |
Jiangfeng Yang, Shaoping Chen*, Zhengliang Du, Jiaolin Cui* |
Dalton Transactions, 40，15228-15236，2014 |
2013 |
Interface kinetics of combustion diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field |
S. P. Chen*, F. Dong, W. H. Fan, Q. S. Meng, Zuhair A. Munir |
Journal of Materials Science
2013,48(3): 1268-1274
|
| 2013, |
梯度金属陶瓷(TiC)pNi与Ti电场燃烧扩散连接界面组织及性能 |
陈少平*，董凤，孟庆森，樊文浩 |
稀有金属材料与工程2013, vol42(2):302-306 |
| 2012 |
In situ synthesis and bonding of Ti TiAl TiC/Ni functionally graded materials by field-activated pressure-assisted synthesis |
Shaoping Chen*, Qingsen Meng, Nan Zhang, Pengfei Xue, Zuhair A. Munir |
Materials Science and Engineering A
538 (2012) 103– 109
|
